Kev sib piv ntawm Aluminium Nitride Copper Clad Substrate Metallization Txheej Txheem Rau IGBT Modules
Apr 07, 2026
Tso lus
Hauv cov cuab yeej hluav taws xob niaj hnub siv hluav taws xob, IGBT modules, raws li cov khoom siv hluav taws xob tseem ceeb, vam khom ntau ntawm cov khoom ntim thiab cov qauv tsim rau kev ua tau zoo thiab kev ntseeg siab. Ntawm cov no, cov tooj liab-clad ceramic substrate, ua ib qho tseem ceeb ntawm tshav kub dissipation thiab hluav taws xob kev twb kev txuas cov cab kuj, ncaj qha cuam tshuam lub module stability nyob rau hauv high voltage, siab tam sim no, thiab complex thermal cycling ib puag ncig los ntawm nws cov txheej txheem metallization. Yog li ntawd, ib qho kev soj ntsuam ntawm kev siv tshuab metallization thiab kev ntseeg siab ntawm aluminium nitride (AlN) ceramic substrates yog qhov tseem ceeb ntawm engineering tseem ceeb rau kev txhim kho tag nrho cov khoom siv hluav taws xob.
Los ntawm kev xaiv cov khoom siv, ntau hom ceramic substrates suav nrog Al₂O₃, AlN, Si₃N₄, thiab SiC. Thaum Al₂O₃ qis- tus nqi thiab muaj cov cuab yeej ua tiav, nws cov thermal conductivity tsawg ua rau nws nyuaj kom ua tau raws li qhov yuav tsum tau muaj zog ceev. Si₃N₄ nthuav tawm cov khoom siv kho tshuab zoo heev, tab sis nws daim ntawv thov raug txwv los ntawm kev tsim technology thiab nqi. Txawm hais tias SiC muaj cov thermal conductivity siab, nws cov khoom dielectric thiab kev ua haujlwm nyuaj txwv nws qhov loj - daim ntawv thov. Hauv qhov sib piv, AlN ceramics tau maj mam dhau los ua qhov kev xaiv tseem ceeb vim lawv cov thermal conductivity, zoo heev rwb thaiv tsev zog, thiab zoo thermal expansion txuam nrog semiconductor cov ntaub ntawv, thiab lawv daim ntawv thov nqi nyob rau hauv metallized ceramic systems txuas ntxiv nce.
Ua ntej, txheeb xyuas cov txheej txheem kev sib txuas ntawm kev sib txuas, cov txheej txheem TFC tso siab rau qhov muag ntawm lub iav theem kom ua tiav cov khoom sib cuam tshuam thiab ntub dej los ntawm kev tshuaj ntsuam - luam tawm tooj liab muab tshuaj txhuam thiab siab - kub sintering; cov txheej txheem DPC yog feem ntau ntawm lub cev adhesion los ntawm sputtering ib Ti / Cu nyias txheej thiab electroplating rau thickening; cov txheej txheem DBC ua tiav metallurgical bonding los ntawm reacting Cu₂O thiab Al₂O₃ ntawm qhov kub thiab txias los tsim cov qauv eutectic; thaum cov txheej txheem AMB tseem txhim kho kev sib raug zoo los ntawm kev tsim cov TiN thiab lwm cov txheej txheem reactive ntawm lub interface siv Ti- muaj cov khoom siv hluav taws xob. Qhov sib txawv ntawm metallization ceramic mechanism yog qhov laj thawj rau kev ua haujlwm sib txawv ntawm cov txheej txheem sib txawv.
Nyob rau hauv cov nqe lus ntawm tev lub zog, cov txheej txheem AMB ua tau zoo tshaj plaws, nrog rau kev sib txuas ntawm lub zog sib txuas mus txog 25 MPa, siab dua li cov txheej txheem DBC, TFC, thiab DPC. Qhov no qhia tau hais tias nyob rau hauv ceramic - mus rau - hlau bonding systems, qhia active yam los txhawb interfacial cov tshuaj tiv thaiv yog ib txoj hauv kev tseem ceeb los txhim kho kev sib raug zoo. Hauv qhov sib piv, cov txheej txheem DPC, tsis muaj txheej txheem metallurgical bonding zoo, muaj qhov adhesion qis, txwv nws daim ntawv thov nyob rau hauv siab - ib puag ncig kev ntxhov siab.
Kev tsom xam ntxiv los ntawm qhov kev xav ntawm thermal cycling kev ntseeg tau pom qhov sib txawv tseem ceeb ntawm ntau lub substrates nyob rau hauv thermal shock tej yam kev mob xws li -55℃mus rau 150℃. DPC substrates tau ntsib kev cuam tshuam kev cuam tshuam ntawm kev suav lub voj voog qis, thaum TFC thiab DBC substrates tau pom qhov sib txawv ntawm lub zog degradation thiab microcracks tom qab lub voj voog nruab nrab suav. Hauv qhov sib piv, AMB substrate tswj kev ua haujlwm ruaj khov tom qab 1500 lub voj voog, feem ntau yog vim nws cov txheej txheem hloov pauv hloov tau yooj yim ntawm qhov cuam tshuam, zoo txo qhov kev ntxhov siab los ntawm thermal expansion mismatch. Cov yam ntxwv no yog qhov tseem ceeb ntawm tus nqi siv rau kev tsim cov khoom muaj zog metallized ceramic.
Kev ntsuas hluav taws xob caij tsheb kauj vab txuas ntxiv ua kom pom qhov sib txawv ntawm cov txheej txheem sib txawv. Nyob rau hauv kev caij tsheb kauj vab mus txog 1200A / 3.3kV, AMB substrate tuaj yeem ua haujlwm ruaj khov rau ntau tshaj 70,000 cycles, tswj xyuas cov txheeb ze txheeb ze thermal. DBC substrate pib degrade tom qab kwv yees li 40,000 cycles, thaum TFC thiab DPC substrates ua tsis tau tejyam nyob rau hauv ib tug txawm ntxov theem. Qhov no qhia tau hais tias nyob rau hauv daim ntawv thov ntawm Metallized Ceramic Housing rau lub hwj chim Semiconductors, interface qauv stability thiab thermal stress buffering muaj peev xwm yog lub ntsiab tseem ceeb txiav txim lub neej.
Los ntawm kev xav txog engineering daim ntawv thov, cov metallization ntawm AlN substrates tsis tsuas yog cuam tshuam rau hluav taws xob kev ua tau zoo tab sis kuj ncaj qha cuam tshuam rau lub sijhawm ntev - kev ntseeg siab ntawm cov qauv ntim. Tshwj xeeb tshaj yog nyob rau hauv cov teb xws li lub zog tshiab, tsheb thauj mus los, thiab cov phiajcim ntse, qhov kev thov rau Precision Metallized Ceramics thiab Metallized Ceramics rau Cov Hluav Taws Xob Hluav Taws Xob txuas ntxiv mus, muab cov kev xav tau ntau dua ntawm cov txheej txheem sib xws thiab kev ntseeg tau.
Tsis tas li ntawd, thaum Precision Metallized Alumina Ceramic Cheebtsam thiab Alumina Metallized Ceramics tseem tuav ib qho kev lag luam sib koom nyob rau hauv siab -precision applications, tag nrho cov kev ua tau zoo ntawm AlN substrates tau tshaj tawm nyob rau hauv siab - zog scenarios. Ua ke nrog precision machining technology rau Alumina ceramic qhov chaw, complex structural designs thiab siab -precision ntim yuav tsum tau ua raws li, ntxiv expanding daim ntawv thov ciam teb ntawm ceramic metallization cov ntaub ntawv.
Zuag qhia tag nrho, cov txheej txheem metallization sib txawv rau alumina lossis aluminium nitride ceramics pom qhov sib txawv tseem ceeb hauv cov qauv sib txuas, kev sib txuas lub zog, thiab kev ua haujlwm thermal cycling. Ntawm lawv, cov txheej txheem AMB, nrog rau nws txoj kev sib txuas lus zoo heev ntawm metallurgical bonding mechanism thiab kev ntxhov siab buffering muaj peev xwm, ua kom pom tseeb qhov zoo dua hauv siab - daim ntawv thov kev ntseeg siab. Nyob rau hauv lub neej yav tom ntej, raws li cov cuab yeej siv hluav taws xob hloov mus rau qhov siab dua tam sim no thiab xav tau kev ua haujlwm ntau dua, kev ua kom zoo ntawm cov hlau nplaum ceramics thiab cov txheej txheem cuam tshuam yuav tseem yog ib qho kev tshawb fawb tseem ceeb.
tiv tauj peb
Yog koj soj ntsuamAlumina Metallized Ceramicsrau cov kev daws teeb meem Bonding lossis nrhiav kev txhawb nqa rau siab -cov ntaub ntawv ntim kev ntseeg siab, thov hu rau peb. Peb yuav muab koj nrog kev cob qhia kev cob qhia thiab kev daws teeb meem rau koj.
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