Kev nce qib hauv Innovative Laminated Busbar Technology: Ib txoj hauv kev tseem ceeb los txhim kho kev ua tau zoo ntawm siab - Lub Hwj Chim Hluav Taws Xob Hluav Taws Xob

Tsav los ntawm txoj kev loj hlob sai ntawm cov tsheb tshiab, lub zog khaws cia, kev lag luam automation, cov khoom siv hluav taws xob hloov pauv, thiab kev ua haujlwm siab - kev ua tau zoo ntawm cov khoom siv hluav taws xob, cov tshuab hluav taws xob niaj hnub tau hloov zuj zus mus rau lub zog ntau dua, kev ua haujlwm ntau dua, thiab muaj kev ntseeg siab dua. Hauv cov ntsiab lus no, cov khoom siv hluav taws xob sib kis yuav tsum tsis yog tsuas yog ua haujlwm siab tam sim no tab sis kuj txo qis zog poob, txo qhov cuam tshuam ntawm cov kab mob parasitic, thiab txhim kho lub sijhawm ntev - ua haujlwm ruaj khov.

 

Raws li qhov tseem ceeb ntawm cov khoom siv hluav taws xob sib txuas hluav taws xob semiconductors, lub zog hluav taws xob, thiab cov khoom thauj, laminated busbars tau dhau los ua cov txheej txheem tseem ceeb hauv kev ua haujlwm siab - cov khoom siv hluav taws xob hluav taws xob. Piv nrog rau cov kab ke ib txwm siv lossis ib qho - txheej tooj liab bar cov qauv, laminated busbars siv kev sib xyaw ua ke ntawm ntau txheej txheej txheej thiab insulating xov xwm kom ua tiav txoj hauv kev luv luv tam sim no, qis kab mob parasitic inductance, thiab siv qhov chaw zoo dua.

 

Raws li cov khoom siv hluav taws xob hloov pauv los ntawm ib txwm siv silicon-raws li IGBTs mus rau siab- hloov cov khoom siv ceev xws li silicon carbide (SiC) MOSFETs, cov kev xav tau ntawm cov qauv busbar tau dhau los ua nruj zuj zus. Lub siab di/dt (tus nqi ntawm kev hloov pauv tam sim no) cuam tshuam nrog siab -kev hloov pauv ceev ua kom muaj kev cuam tshuam ntawm cov kab mob parasitic inductance, ua rau muaj qhov hluav taws xob overshoot, electromagnetic cuam tshuam (EMI), thiab kev hloov pauv ntxiv.

 

Yog li ntawd, lub tshuab laminated busbar thev naus laus zis tau hloov zuj zus los ntawm ib qho hluav taws xob xa mus rau hauv ib qho tseem ceeb tsim qhov cuam tshuam rau tag nrho cov kev ua tau zoo thiab kev ntseeg siab ntawm lub zog hluav taws xob hluav taws xob.

 

 

 

Traditional laminated busbars feem ntau muaj cov txheej txheem tooj liab, insulating txheej, thiab cov qauv laminated sib dhos; Lawv txo lub voj inductance los ntawm nruj stacking zoo thiab tsis zoo conductors kom txo cov hlau nplaum sib txuas. Txawm li cas los xij, cov qauv tsim qauv ntsib qee qhov kev txwv kev ua haujlwm hauv siab - zaus, siab - daim ntawv thov fais fab.

 

Ua ntej, muaj peev xwm tswj cov kab mob parasitic inductance yog qhov tseem ceeb cuam tshuam rau kev ua haujlwm ntawm lub cev. Thaum lub sij hawm siab - hloov pauv ntawm cov khoom siv hluav taws xob xws li IGBTs thiab SiC modules, stray inductance nyob rau hauv lub busbar generates transient voltage spikes, qhov loj ntawm uas yog ncaj qha proportional rau tus nqi ntawm tam sim no hloov. Raws li kev khiav hauj lwm zaus nce, qhov inductance muaj nyob rau hauv cov qauv ib txwm muaj peev xwm txwv kev hloov ceev, tiv thaiv cov cuab yeej los ntawm kev ua kom muaj txiaj ntsig zoo ntawm kev ua haujlwm siab - zaus.

 

Thib ob, siab - lub zog ua haujlwm ua rau muaj kev xav tau ntau ntxiv ntawm kev tswj xyuas thermal. Raws li tam sim no ceev nce, qhov tseem ceeb Joule cua sov tshwm sim nyob rau hauv lub conductors, thaum tshav kub generated los ntawm lub hwj chim modules ib txhij xa mus rau lub busbar los ntawm kev sib txuas qauv. Yog tias kev tswj xyuas thermal tsim tsis txaus, kev ua haujlwm ntev ntawm qhov kub siab tuaj yeem ua rau cov khoom siv tsis zoo thiab ua rau lub cev luv luv.

 

Tsis tas li ntawd, muaj chav rau kev txhim kho kev ua tau zoo hauv cov khoom siv hluav taws xob thiab cov khoom siv insulating. Piv txwv li, thaum tus qauv tooj liab conductors muaj kev ua tau zoo heev, lawv muaj kev txwv txog kev txo qhov hnyav thiab lub zog txhua yam; Cov khoom siv insulating ib txwm tuaj yeem raug kev txom nyem los ntawm cov khoom siv hluav taws xob tsis zoo thaum raug kub siab, siab voltages, thiab ntev - lub sij hawm thermal cycling.

 

Yog li ntawd, tus tsim ntawm niaj hnub laminated busbars yuav tsum tau optimization nyob rau hauv ntau qhov ntev -nrog rau cov ntaub ntawv, qauv, manufacturing txheej txheem, thiab ntse saib xyuas- kom ua tau raws li cov kev xav tau ntawm tom ntej no - tiam, siab - efficiency hluav taws xob electronics.

 

 

Cov khoom siv optimization yog lub hauv paus tseem ceeb rau kev txhim kho laminated busbar kev ua tau zoo. Kev tsim kho rau cov khoom siv hluav taws xob tsom feem ntau ntawm kev ua kom muaj zog, txhim kho cov khoom siv hluav taws xob, thiab txo qhov hnyav tag nrho.

 

Tsob ntoo ntshiab tooj liab tseem yog ib qho kev xaiv tseem ceeb rau laminated busbars vim nws cov hluav taws xob siab. Txawm li cas los xij, raws li lub zog tshiab tsheb, daim phiaj hluav taws xob khaws cia, thiab cov cuab yeej siv kev lag luam mus rau cov qauv tsim, cov khoom siv tooj liab tshiab tau nce ntxiv hauv kev ua haujlwm siab - kev ua haujlwm busbar. Piv txwv li, qee cov tooj liab alloys muaj kev txhim kho tensile zog thiab kub tsis kam thaum tswj kev ua haujlwm siab; qhov no tso cai rau optimized conductor thickness, yog li txo qhov hnyav thiab txhim kho qhov chaw siv.

 

Aluminium-raws li kev sib xyaw tseem tab tom tshwm sim los ntawm kev tshawb fawb rau qhov hnyav- cov ntawv thov nkag siab. Los ntawm kev siv thev naus laus zis sib xyaw, cov ntaub ntawv no tuaj yeem ua tiav qhov ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntim cov khoom siv hluav taws xob cov khoom siv hluav taws xob thiab cov khoom siv mobile.

 

Hais txog kev rwb thaiv tsev, tshiab siab - cov ntaub ntawv ua yeeb yaj kiab ua haujlwm tau ua rau cov laminated busbars ua haujlwm ntawm qib siab dua. Cov ntaub ntawv xws li polyimide (PI), hloov kho epoxy resins, thiab nanocomposite insulators muaj qhov kub thiab txias tsis kam, cov khoom siv hluav taws xob ruaj khov dua, thiab txhim kho lub sijhawm ntev - kev ntseeg siab, ua kom muaj kev ua haujlwm tsis tu ncua hauv ib puag ncig hnyav.

 

Piv txwv li, nyob rau hauv siab - cov khoom siv ntau zaus, laminated busbars tsim rau kev sib txawv zaus tsav (VFDs) tuaj yeem txo qhov cuam tshuam inductance thiab txhim kho lub zog hloov hluav taws xob los ntawm kev txhim kho tus neeg xyuas pib thiab kev tsim cov qauv rwb thaiv tsev.

 

Simultaneously, advancements in ultra-thin insulation layer technology have further enhanced the integration capabilities of busbars. Txo qhov sib nrug ntawm cov khaubncaws sab nraud povtseg-thaum tseem ua tau raws li qhov yuav tsum tau muaj kev tiv thaiv kev nyab xeeb- txhim kho qhov kev tshem tawm ntawm cov hlau nplaum uas tsim los ntawm qhov zoo thiab tsis zoo conductors, yog li txo qis tag nrho cov kab mob parasitic inductance.

 

 

 

Kev ua tau zoo ntawm laminated busbars tsis yog nyob ntawm kev xaiv khoom nkaus xwb tab sis kuj nyob ntawm lawv cov qauv tsim sab hauv.

 

Cov qauv txheej txheem txheej txheem tau hloov zuj zus mus rau peb - qhov sib xyaw ua ke. Optimizing qhov layout ntawm conductive khaubncaws sab nraud povtseg, txo tam sim no voj lengths, thiab kho lub davhlau ya nyob twg kev twb kev txuas cov ntsiab lus yuav ua tau zoo txo ​​cov parasitic tsis raws txoj kev tam sim no commutation.

 

Hauv cov tshuab hluav taws xob tsav tsheb rau lub zog tshiab, cov tswj lub cev yuav tsum xa cov khoom ruaj khov, siab - cov zis tam sim no thaum ua haujlwm ntawm kev hloov pauv ceev; Yog li ntawd, cov qauv busbar yuav tsum sib npaug qis inductance nrog lub peev xwm kub kub dissipation. Tshwj xeeb tsim lub cev muaj zog maub los busbars siv cov kev sib txuas ua ke kom txo qis kev sib txuas ntawm cov fais fab modules, yog li boosting tsav system tag nrho cov efficiency.

 

Kev ua kom zoo dua qub yog qhov tseem ceeb sib npaug rau cov khoom siv hluav taws xob muaj zog. Piv txwv li, qis -inductance busbar tsim nyob rau hauv compact IGBT DC fais fab kev thov yuav tsum xyuas kom meej lub shortest tau commutation txoj kev ntawm lub IGBT module thiab DC capacitor kom txo tau kev hloov pauv kev ntxhov siab.

 

Tsis tas li ntawd, niaj hnub laminated busbars nce ntxiv nrog thermal tswj nta. Cov txheej txheem xws li embedding nyob rau hauv cov cua txias raws, nce tshav kub dissipation nto thaj chaw, los yog integrating kua txias systems yuav ua tau zoo txo ​​qis kev khiav hauj lwm kub thiab ua kom muaj kev tso cai tam sim no ceev.

 

Hauv loj - cov khoom siv sib txuas lus cov ntaub ntawv loj, siab - lub zog ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom cov khoom siv cov khoom siv sib txuas lus loj

 

Yog li ntawd,laminated busbarstsim los rau supercomputer circuit boards lossis backplanes yuav tsum ua kom ruaj khov, siab - fais fab kev faib tawm nyob rau hauv qhov chaw kaw thaum ib txhij txo qhov cuam tshuam ntawm electromagnetic cuam tshuam nrog kev ua haujlwm siab - zaus.